Characterisation of Thermal Expansion Coefficient of Anisotropic Materials by Electronic Speckle Pattern Interferometry
Author:
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1475-1305.2006.00271.x/fullpdf
Reference9 articles.
1. 1. Yang, L. and Ettemeyer, A. (2003) Strain Measurement by Three-Dimensional Electronic Speckle Pattern Interferometry: Potentials, Limitations, and Applications. Optical Engineering SPIE, Vol. 42, No. 5, SPIE Press, Bellingham, WA.
2. Holographic and Speckle Interferometry
3. Mechanisches Verhalten von Fichtenholz
4. In situ and real-time tensile testing of thin films using double-field-of-view electronic speckle pattern interferometry;Xide;Meas. Sci. Technol.,2004
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