Author:
Lin Y.C.,Chen Xiao-Min,Zhang Jun
Funder
National Natural Science Foundation of China
Sheng-hua Yu-ying Program of Central South University
Subject
Polymers and Plastics,Organic Chemistry
Reference39 articles.
1. Conductive Adhesives for Electronics Packaging;Liu,1999
2. Electronics Manufacturing: with Lead-free, Halogen-free, and Conductive Adhesive Materials;Lau,2002
3. Reliability of anisotropic conductive adhesive joints in electronic packaging applications;Lin;Journal of Adhesion Science and Technology,2008
4. Dielectric studies of water absorption and desorption in epoxy resins: influence of cure process on behaviour;McConnell;Polymer International,2008
5. Description of nonlinear viscoelastic behavior and creep-rupture time of anisotropic conductive film;Gao;Materials Science and Engineering:A,2010
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