Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications-Reference-Cited by-同舟云学术

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

Published:2008-01 Issue:14 Volume:22 Page:1631-1657
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Lin Y. C.,Chen X.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference129 articles.

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2. Lu, D., Tong, Q. K. and Wong, C. P. 1999.Proceedings of the 49th IEEE Electronic Components and Technology Conference347–352. San Diego, CA

3. ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges

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