Femtosecond laser dicing of ultrathin Si wafers with Cu backside layer - A fracture strength and microstructural study

Author:

Marks Michael Raj,Cheong Kuan YewORCID,Hassan Zainuriah

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference64 articles.

1. Ultrathin wafer pre-assembly and assembly process technologies: a review;Marks;Crit Rev Solid State Mater Sci,2015

2. Die singulation technologies for advanced packaging: a critical review;Lei;J Vacuum Sci Technol B,2012

3. Femtosecond laser ablation: challenges and opportunities;Jiang,2003

4. Fundamental aspects in machining of metals with short and ultrashort laser pulses;Breitling,2004

5. Laser-solid interaction in the femtosecond time regime;von der Linde;Appl Surf Sci,1997

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