Study on nanometer cutting mechanism of single crystal silicon at different temperatures-Reference-Cited by-同舟云学术

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Study on nanometer cutting mechanism of single crystal silicon at different temperatures

Published:2023-05 Issue: Volume:93 Page:275-286
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Ye Guigen,Zhang Peng,Zhang Jiansheng,Zhang Yi,Huang Xiaoguang

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference59 articles.

1. Molecular dynamics simulation of nanoindentation-induced mechanical deformation and phase transformation in single crystal silicon[J];Lin;Nanoscale Res Lett,2008

2. Influence of temperature on the anisotropic cutting behaviour of single crystal silicon: a molecular dynamics simulation investigation[J];Chavoshi;J Manuf Process,2016

3. XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer[J];Zong;Int J Mach Tool Manuf,2008

4. Material removal mechanisms in lapping and polishing[J];Evans;CIRP Ann,2003

5. Ductile-regime machining model for diamond turning of brittle materials[J];Blackley;Precis Eng,1991

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3. In situ laser-assisted diamond turning of Ni-P alloy coating on mold core surface;The International Journal of Advanced Manufacturing Technology;2024-08-22

4. Effect of rapid thermal annealing on the surface properties of the microlens arrays machined on monocrystalline silicon;Applied Surface Science;2024-04

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