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Fabrication of diamond/AlSi10Mg composite using SLM: Effects of processing parameters and pre−/post-treatments

  • Published:2023-06 Issue: Volume:95 Page:27-37
  • ISSN:1526-6125
  • Container-title:Journal of Manufacturing Processes
  • language:en
  • Short-container-title:Journal of Manufacturing Processes

Author:

Wang Yuxuan,Hao Menglong,Wang Jialong,Li Menglin,Gu Zhenghao,Meng Chenyu,Deng Renming,Sun Yiwei

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference37 articles.

1. Chip power density and module cooling technology projections for the current decade;Ellsworth,2004

2. Research status of metal matrix composites for electronic packaging;Huang;J Electron Packag,2003

3. Tailoring interfacial bonding states of highly thermal performance diamond/Al composites: spark plasma sintering vs vacuum hot pressing;Tan;ComposA Appl Sci,2016

4. Microstructure of diamond/aluminum composites fabricated by pressureless metal infiltration;Shi;Compos B Eng,2011

5. Improvement of thermal conductivity of diamond/Al composites by optimization of liquid-solid separation process;Zhou;J Mater Process Technol,2021

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