Relation between acoustic emission analysis during cure cycle and bonded joints performances-Reference-Cited by-同舟云学术

Relation between acoustic emission analysis during cure cycle and bonded joints performances

Published:1999-09 Issue:6 Volume:32 Page:333-341
ISSN:0963-8695
Container-title:NDT & E International
language:en
Short-container-title:NDT & E International

Author:

Santulli C.,Lucia A.C.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science

Reference24 articles.

1. Non-destructive inspection of adhesively bonded joints;Adams;J. of Adhesion,1987

2. The reflection of ultrasound from interface layers in adhesive joints;Pialucha;Review of Progress in Quantitative Non destructive Evaluation,1900

3. Rose JL, Ditri JJ, Pilarski A. Using Lamb waves to control adhesive joints of metallic structures in aircraft. II giornale delle PnD, monitoraggio diagnostica. 4-1994 (November).

4. Muravin GB, Leksovskii AM, Zimting VN, Kubasov NI, Rozumovich EE. An analysis of the adhesive properties of adhesive-bonded joints by the acoustic emission method. Defektoskopiya, November 1991. p. 56–63.

5. Youssef Y, Fahr A, Roy C. NDE of adhesively bonded joints using acousto-ultrasonics and pattern recognition. 4th Int. Symp. On nondestructive characterization of materials, June 1990, Annapolis, Maryland.

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