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Thermal transient testing

Published:2018 Issue: Volume: Page:127-153
ISSN:
Container-title:Wide Bandgap Power Semiconductor Packaging
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Author:

Farkas Gábor,Hara Tomoaki,Rencz Márta

Publisher

Elsevier

Reference19 articles.

1. Thermal transient characterization of semiconductor devices with programmed powering;Farkas,2013

2. Identification of RC networks by deconvolution: chances and limits;Szekely;IEEE Trans. Circuits Syst. I: Fundam. Theory Appl.,1998

3. Transient measurement of the junction-to-case thermal resistance using structure functions: chances and limits;Schweitzer,2008

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. On the Accuracy and Repeatability of Thermal Transient Measurements;Theory and Practice of Thermal Transient Testing of Electronic Components;2022

2. The Use of Thermal Transient Testing;Theory and Practice of Thermal Transient Testing of Electronic Components;2022

3. Thermal Transient Measurements on Various Electronic Components;Theory and Practice of Thermal Transient Testing of Electronic Components;2022

4. Thermal Metrics;Theory and Practice of Thermal Transient Testing of Electronic Components;2022

5. Theoretical Background of Thermal Transient Measurements;Theory and Practice of Thermal Transient Testing of Electronic Components;2022

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