Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
157 articles.
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1. Thermal Characterization of Power Module with BCI-ROMs;2023 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific);2023-11-28
2. An automated method for creating compact dynamic thermal models for in-situ prognostics of power electronics and power LED packages;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Tridiagonal Approaches for Network Identification by Deconvolution;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
4. Thermal Time Constant CNN-Based Spectrometry for Biomedical Applications;Sensors;2023-07-25
5. Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications;2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE);2023-07-17