1. Interconnect scaling: Challenges and opportunities;Brain,2016
2. Impact of anode-side defect generation on inter-level TDDB degradation in Cu/Low-k damascene structures;Suzumura,2020
3. Current understanding of BEOL TDDB lifetime models;Croes;ECS J Solid State Sci Technol,2015
4. Time dependent dielectric breakdown in copper low-k interconnects: Mechanisms and reliability models;Wong;Materials (Basel),2012
5. Random telegraph noise: From a device physicist’s dream to a designer’s nightmare;Simoen;ECS Trans,2011