Author:
Oh Soon-Young,Ahn Chang-Geun,Yang Jong-Heon,Cho Won-Ju,Lee Woo-Hyun,Koo Hyun-Mo,Lee Seong-Jae
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. 3D ICs: a novel chip design for improving submicrometer interconnect performance and systems-on-chip integration;Banerjee;Proceedings of the IEEE,2001
2. Three-dimensional IC trends;Akasaka;Proceedings of the IEEE,1986
3. Three-dimensional integrated circuits;Topol;IBM J Res & Dev,2006
4. Victor WC. Chan, Philip CH Chan, Chan M. Three dimensional CMOS integrated circuits on large grain polysilicon films. In: IEEE IEDM tech dig, 2000. p. 161–4.
5. A stacked CMOS technology on SOI substrate;Zhang;IEEE Electron Dev Lett,2004
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