Author:
Li L.-G.,Vallin Ö.,Lu J.,Smith U.,Norström H.,Olsson J.
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. Olsson J, Vallin Ö, Sjöblom G, Norström H, Smith U, Vestling L, et al. In: IEEE international SOI conference; 2007. p. 115.
2. Effects of temperature and disorder on thermal boundary conductance at solid–solid interfaces: Nonequilibrium molecular dynamics simulations
3. SullivanJ, Kirk HR, Kang Sien, Ong PJ, Henley FJ. In: IEEE 2006, International SOI conference; 2006. p. 39–40.
4. Oxide-Free Silicon to Silicon Carbide Heterobond
5. Adhesion quantification methods for wafer bonding
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