Author:
Monier-Vinard Eric,Laraqi Najib,Dia Cheikh-Tidiane,Nguyen Minh-Nhat,Bissuel Valentin
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Calculation and analysis of thermal impedance of microelectronic structures from analytical models;Vintrou;Solid-State Electron,2012
2. Evaluation of inherent uncertainties of the homogeneous effective thermal conductivity approach in modeling of printed circuit boards for space applications;Lopes Costa;J Electron Cool Therm Control,2013
3. Karayacoubain P, Yovanovich MM, Culham JR. Thermal resistance based bounds for effective conductivity of composite thermal interface materials. In: Proc 22nd IEEE semiconductor thermal measurement and management symposium, 2006, Dallas (Texas), USA, Paper No. 1-4244-0154-2.
4. Kotetov R, Andritsch T, Lafont U. Thermal behaviour of epoxy resin filled with high thermal conductivity nano-powders IEEE electrical insulation conference, Montreal, Canada; 2009.
5. Schacht R, Wunderle B, May D, Michel B, Reichl H. Modeling guidelines and non-destructive analysis for thermal and mechanical behaviour of via-structures in organic boards. In: Thermal and thermomechanical phenomena in electronic systems conference; 2008. p. 441–9.
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