Method of activation energy analysis and application to individual cells of 256Mb DRAM in 110nm technology

Author:

Weber A.,Birner A.,Krautschneider W.

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. A 0.6μm2 256Mb Trench DRAM cell with self-aligned BurieEd STrap (BEST);Nesbit;IEDM Tech Dig,1993

2. On the retention time of dynamic random access memory (DRAM);Hamamoto;IEEE Trans Electron Dev,1998

3. Theoretical study of deep-trap-assisted anomalous currents in worst-bit cells of dynamic random access memories (DRAM’s);Yamaguchi;IEEE Trans Electron Dev,2000

4. Impact of gate-induced drain leakage current on the tail distribution of DRAM data retention time;Saino;IEDM Tech Dig,2000

5. Off-state current model for tail mode retention time distribution of 256Mb DRAM cell with negative wordline bias;Yi;J Korean Phys Soc,2004

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