Application of adhesive bonding techniques in hard disk drive head assembly-Reference-Cited by-同舟云学术

Application of adhesive bonding techniques in hard disk drive head assembly

Published:2002-04 Issue:4-5 Volume:42 Page:767-777
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Luk C.F.,Chan Y.C.,Hung K.C.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

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3. Lyons AM, Wong CP. Recent advances and evaluation of anisotropically conductive adhesives for microelectronics assembly. Electrochemical Publications; 1999

4. Mannan SH, Williams DJ, Whalley DC, Ogunjimi AO. Models to determine guidelines for the anisotropic joining process. Electrochemical Publications; 1999

5. ANSYS Theory Reference. 000656. 7th ed. SAS IP. Inc.; 1996

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