A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength

Abstract

In electronic flexible printed circuit (E-FPC) manufacturing procedure, the cover laminating process in which the line circuit (copper wire) is covered with hot cover layer on the printed circuits is importance process. This process will help to increase elasticity, strength and corrosion protection to the product therefore this process can affect directly to quality of the printed circuit. The process for laminating printed circuits can be classified into two methods by coating with industry iron and hot bar machine. This article compares the quality of the electrical circuit between industry iron and hot bar machine methods in the cover coating process by using Peeling Strength to indicate the quality in the same temperature and time condition. The experimental result illustrates the electrical circuits using the hot bar machine method give Peeling Strength value in the acceptable range and the laminating surface of circuits is smooth and uniform. On the other hand, Peel Strength value of electrical circuits using the industry iron method is unsteady and lower than the acceptable range. Moreover the result circuit product has wrinkled coating surface and become the waste product.