Author:
Lin T.Y.,Leong W.S.,Chua K.H.,Oh R.,Miao Y.,Pan J.S.,Chai J.W.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Manufacturing techniques for surface mounted assemblies;Klein Wassink,1995
2. Lin TY, Leong WS. Root cause analysis of non-stick on lead (NSOL) and verification of TQFP176 etched leadframe. Lucent internal report, 2000
3. An investigation on the plasma treatment of integrated circuit bond pads;Chong;Microelectron. Reliab.,2000
4. Characterizing integrated circuit bond pads;Lowry,1992
5. Reliability effects of fluorine contamination of aluminum bonding pads on semiconductor chips;Graves;Solid State Technol.,1983
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献