Tin contamination in PQFN package and its effects on wire bondability-Reference-Cited by-同舟云学术

Tin contamination in PQFN package and its effects on wire bondability

Published:2013-07-26 Issue:3 Volume:30 Page:176-186
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:Microelectronics International

Author:

Zong Fei,Wang Zhi‐jie,Xu Yan‐bo,Niu Ji‐yong,Zhang Han‐min

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process

2. Freescale Semiconductor (2007),Power Quad Flat No‐lead (PQFN) Package, available at: www.freescale.com/files/analog/doc/app_note/AN2467.pdf (accessed 23 October 2012).

3. Iterative optimization of tail breaking force of 1mil wire thermosonic ball bonding processes and the influence of plasma cleaning

4. The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method

5. Nowful, J.M. and Lok, S.C. (2001), “Effects of plasma cleaning on the reliability of wire bonding”,2001 International Symposium on Electronic Materials and Packaging, IEEE, Jeju Island, pp. 39‐43.

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