Author:
Palm Petteri,Määttänen Jarmo,De Maquillé Yannick,Picault Alain,Vanfleteren Jan,Vandecasteele Björn
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Savolainen P. Solder-filled anisotropically conductive adhesives in electronic interconnections. PhD Thesis, 1996, HUT, Espoo, Finland
2. Assembly and reliability of flip chip on boards using ACA’s or eutectic solder with underfill;Zhong;Microelectron. Int.,1999
3. Määttänen J, Palm P, Tuominen A. Conductive model of anisotropically conductive adhesives. IMAPS Nordic, 10–13 September 2000, Helsingor, Denmark
4. Materials for flexible circuits;Sheldahl,1996
5. Palm P, Määttänen J, Picault A, De Maguille Y. The evaluation of different base materials for high density flip chip on flex applications. In: 13th European Microelectronics and Packaging Conference. IMAPS, 30 May–1 June, Strasbourg, France
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献