Solder joint reliability of a low cost chip size package—NuCSP

Author:

Lau J.H

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Lau JH, Pao YH. Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies. New York: McGraw-Hill, 1997

2. Lau JH. Flip chip technologies. New York: McGraw-Hill, 1996

3. Lau JH. Ball grid technology. New York: McGraw-Hill, 1995

4. Lau JH. Chip on board technologies for multichip modules. New York: Van Nostrand Reinhold, 1994

5. Lau JH. Thermomechanical characterization of flip chip solder bumps for multichip module applications. Proceedings of IEEE International Electronics Manufacturing Technology Symposium, Baltimore, MD, USA, 1992;293–9

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