Plasma cleaning of plastic ball grid array package-Reference-Cited by-同舟云学术

Plasma cleaning of plastic ball grid array package

Published:1999-01 Issue:1 Volume:39 Page:97-105
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lee C,Gopalakrishnan R,Nyunt K,Wong A,Tan R.C.-E,Ong J.W.-L

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference24 articles.

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4. Korner N, Beck E, Dommann A, Ramm J. Hydrogen plasma chemical cleaning of metallic substrates and silicon wafers. In: Surface and Coatings Technology. Vols 76. Oxford: Elsevier Science, 1995. p. 731–737

5. Liston EM, Martinu L, Wertheimer MR. Plasma surface modification of polymers for improved adhesion: a critical review. Plasma Surface Modification of Polymers. VSP. 1994. p. 3–39

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