Thermal fatigue and metallurgical reactions in solder joints of LTCC modules-Reference-Cited by-同舟云学术

Thermal fatigue and metallurgical reactions in solder joints of LTCC modules

Published:2000-08 Issue:8-10 Volume:40 Page:1527-1532
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Rautioaho R.,Nousiainen O.,Saven T.,Leppävuori S.,Lenkkeri J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Aging effects on shear fatigue life and shear strength of soldered thick film joints;Li;IEEE Trans. on Components, Packaging, and Manufacturing Technology - Part B,1998

2. Interactions between silver-palladium metallization and tinlead-silver solder;Li;Phys. Stat. Sol.-A,1998

3. Degradation of soldered thick film conductor during thermal cycling;Yamada,1992

4. The thermal-cycled adhesion strength of soldered thick film silver-bearing conductors;Needes,1989

5. Step soldering factors affecting the reliability of AgPd thick film conductor pads;Pan,1996

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5. Effect of thermal cycling on the growth of intermetallic compounds at the Sn-Zn-Bi-In-P lead-free solder/Cu interface;Journal of Electronic Materials;2006-10