Author:
Tao Yi,Malshe Ajay P,Brown William D
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference13 articles.
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4. Tao Yi, Malshe AP, Brown WD. Laser bonding and modeling for wafer-level and chip-scale vacuum packaging of MEMS. In: Proceedings of ASME 2002 International Mechanical Engineering Congress and Exposition, New Orleans, Louisiana, USA, 17–22 November 2002
5. Hermetic wafer bonding based on rapid thermal processing;Chiao;Sens. Actuat. (Phys.) A,2001
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