Current and future trends in micro-joining and nano-joining-Reference-Cited by-同舟云学术

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Current and future trends in micro-joining and nano-joining

Published:2022 Issue: Volume: Page:209-239
ISSN:
Container-title:Joining Processes for Dissimilar and Advanced Materials
language:
Short-container-title:

Author:

Choudhury Mridusmita Roy,Debnath Kishore

Publisher

Elsevier

Reference96 articles.

1. Microjoining and nanojoining;Zhou,2008

2. Nanotechnology to nanomanufacturing;Ahmed,2010

3. Vacuum welding of metals;Stohr,1958

4. Technique for connecting electrical leads to semiconductors;Anderson;J Appl Phys,1957

5. Wire bonding in microelectronics-materials, processes, reliability and yield;Harman,2010

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Site-selective core/shell deposition of tin on multi-segment nanowires for magnetic assembly and soldered interconnection;Nanotechnology;2024-06-14

2. Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19

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