Author:
Wiese S.,Feustel F.,Meusel E.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference14 articles.
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4. S. Wiese, F. Feustel, S. Rzepka, E. Meusel, Experimental characterisation of material properties of Sn63Pb37 flip chip solder joints, in: D.J. Belton, M. Gaynes, E.G. Jacobs, R. Pearson, T. Wu (Eds.), Proceedings of the Tenth MRS Symposium on Electronic Packaging Materials Science, Vol. 515, Materials Research Society, San Francisco, 14–16 April 1998, pp. 233–238.
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