UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole-Reference-Cited by-同舟云学术

UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole

Published:2000-09 Issue:3 Volume:84 Page:342-350
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Chang Hyun-Kee,Kim Yong-Kweon

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference7 articles.

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4. Negative photoresists for optical lithography;Shaw;IBM J. Res. Dev.,1997

5. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist for MEMS applications;Despont,1997

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