Current envelope analysis for defect identification and diagnosis in induction motors-Reference-Cited by-同舟云学术

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Current envelope analysis for defect identification and diagnosis in induction motors

Published:2012-10 Issue:4 Volume:31 Page:380-387
ISSN:0278-6125
Container-title:Journal of Manufacturing Systems
language:en
Short-container-title:Journal of Manufacturing Systems

Author:

Wang Jinjiang,Liu Shaopeng,Gao Robert X.,Yan Ruqiang

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Hardware and Architecture,Software,Control and Systems Engineering

Reference39 articles.

1. Trends and perspectives in industrial maintenance management;Luxhoj;Journal of Manufacturing Systems,1997

2. Process monitoring with sensory machine tool components;Mohring;CIRP Annals,2010

3. Integrated condition monitoring and fault diagnosis for modern manufacturing systems;Zhou;CIRP Annals,2000

4. Mapping theory: a new approach to design of multi-sensor monitoring of reconfigurable machining systems (RMS);Mehrabi;Journal of Manufacturing Systems,2001

5. Multisensor process performance assessment through use of autoregressive modeling and feature maps;Casoetto;Journal of Manufacturing Systems,2003

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