Electrical properties of Ti/TiN films prepared by chemical vapor deposition and their applications in submicron structures as contact and barrier materials-Reference-Cited by-同舟云学术

Electrical properties of Ti/TiN films prepared by chemical vapor deposition and their applications in submicron structures as contact and barrier materials

Published:1997-10 Issue: Volume:308-309 Page:589-593
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Hu J,Ameen M,Leusink G,Webb D,Hillman J.T

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference10 articles.

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2. S.R. Kurtz and R.G. Gordon, Thin Solid Films, 140 (1986) 277.

3. W. Tsai, M. Delfino, J.A. Fair, and D. Hodul, J. Appl. Phys., 73 (1993) 4462.

4. C. Arena, J. Faguet, R.F. Foster, J.T. Hillman, F. Martin, and Y. Morand, Advanced Metallization for ULSI Applications, MRS, 1994, p. 259.

5. R.I. Hegde, R.W. Fiordalice, E.O. Travis and P.J. Tobin, J. Vac. Sci. Technol., 11 (1993) 1287.

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