Material characterization of Cu(Ti)–polyimide thin film stacks
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Diffusion in Amorphous Materials;Gupta,1993
2. Tungsten and Other Advanced Metals for VLSI/ULSI Applications V;Hu,1989
3. Preparation of low resistivity Cu–1 at. %Cr thin films by magnetron sputtering
4. Effects of the addition of small amounts of Al to copper: Corrosion, resistivity, adhesion, morphology, and diffusion
5. The role of texture in the electromigration behavior of pure aluminum lines
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Study on Adhesion Reliability and Particle Inhibition of Epoxy Resin Coating in DC GIL after Thermal Ageing Experiment;Coatings;2022-06-17
2. Combined TEM and XPS studies of metal - polymer interfaces for space applications;Surface and Coatings Technology;2017-12
3. Improvement of NiMoNb to polyimide adhesion by inductively coupled nitrogen plasma treatment;Applied Surface Science;2016-01
4. Highly-enhanced reflow characteristics of sputter deposited Cu interconnections of large scale integrated devices by optimizing sputtering conditions;Journal of Applied Physics;2013-07-28
5. Effect of Hydrogen on Vacancy Formation in Sputtered Cu Films Studied by Positron Annihilation Spectroscopy;Japanese Journal of Applied Physics;2013-04-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3