Advances in magnetron sputter sources-Reference-Cited by-同舟云学术

Advances in magnetron sputter sources

Published:1999-08 Issue:1-2 Volume:351 Page:15-20
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

De Bosscher Wilmert,Lievens Hugo

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. H.E. McKelvey, Magnetron cathode sputtering apparatus, US patent 4,356,073, Oct. 1982.

2. Design advances and applications of the rotatable cylindrical magnetron

3. U. Heister,J. Krempel-Hesse,J. Szczyrbowski,G. Bräuer, New Developments in the Field of MF-Sputtering with Dual Magnetron to Obtain Higher Productivity for Large Area Coatings, 41st. Annu. Tech. Conf. Soc. Vac. Coaters, 1998, p. 190.

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Copper target erosion during unbalanced magnetron sputtering under different electromagnetic fields;Surface and Coatings Technology;2024-02

2. Gas-phase synthesis of nanoparticles: current application challenges and instrumentation development responses;Physical Chemistry Chemical Physics;2023

3. The dependence of the surface roughness of aluminum nitride films on the processing methods when magnetron sputtering is used;Journal of Physics: Conference Series;2022-05-01

4. Ion energy control via the electrical asymmetry effect to tune coating properties in reactive radio frequency sputtering;Plasma Sources Science and Technology;2019-11-01

5. A stable and diffusive atmospheric pressure glow discharge in ambient air obtained by applying an axial magnetic field between pin-to-plate electrodes;Physics of Plasmas;2018-10