Additive channel-constrained metallization of high-resolution features-Reference-Cited by-同舟云学术

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Additive channel-constrained metallization of high-resolution features

Published:2000-12 Issue:1-2 Volume:379 Page:203-212
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Chen Mu-San,Brandow Susan L,Dressick Walter J

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference38 articles.

1. Laser-Enhanced Palladium Electroless Plating

2. Pattern Formation of Cu Layer by Photocatalytic Reaction of ZnO Thin Film

3. Process synthesis and design for multi-chip module fabrication

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3. Reversible Soft Top-Contacts to Yield Molecular Junctions with Precise and Reproducible Electrical Characteristics;Advanced Functional Materials;2014-04-16

4. Selective Metal Pattern Fabrication Through Micro-Contact or Ink-Jet Printing and Electroless Plating onto Polymer Surfaces Chemically Modified by Plasma Treatments;The Journal of Adhesion;2009-09-18

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