Joint strength and interfacial microstructure between Sn–Ag–Cu and Sn–Zn–Bi solders and Cu substrate
Author:
Publisher
Informa UK Limited
Subject
General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1016/j.stam.2003.10.024
Reference13 articles.
1. Lead-free Solders in Microelectronics
2. The Development and Commercialization of Lead-Free Soldering
3. Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders
4. Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
5. Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball
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