Author:
Fu Wu-Shung,Tong Bao-Hong
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference24 articles.
1. Enhanced and local heat transfer, pressure drop, and flow visualization;Sparrow;Int. J. Heat Mass Transfer,1983
2. Y. Wang, A.J. Ghajar, Effect of component geometry and layout on flow distribution for surface mounted electronic components: a smoke flow visualization study, ASME HTD-Vol. 183, Heat Transfer Enhancement in Electronics Cooling, 1991, pp. 25–31
3. Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronic modules;Jubran;Int. J. Heat Mass Transfer,1996
4. Convective flow and heat transfer in a channel containing multiple heated obstacles;Young;Int. J. Heat Mass Transfer,1998
5. Conjugate heat transfer analysis for the passive enhancement of electronic cooling through geometric modification in a mixed convection domain;Hung;Num. Heat Transfer A,1999
Cited by
52 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献