Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronic modules
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference13 articles.
1. Calculation of surface heat transfer coefficients for electronic module packages;Buller,1981
2. Heat transfer and pressure drop characteristics of array of rectangular modules in electronic equipment;Sparrow;J. Heat Mass Transfer,1982
3. Enhanced and local heat transfer, pressure drop and flow visualization for arrays of block-like electronic components;Sparrow;J. Heat Mass Transfer,1983
4. Convective heat transfer response to height differences in an array of block-like electronic components;Sparrow;J. Heat Mass Transfer,1984
5. Heat transfer from array of flatpacks in a channel flow;Wirtz,1984
Cited by 54 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation of heat transfer enhancement of heated block by using baffles;AIP Conference Proceedings;2024
2. Geometric modification and placement of high heat flux ic chips on substrates of different materials for enhanced heat transfer;Journal of Thermal Engineering;2023-11-30
3. Experimental investigation of the effect of flexible/rigid flag on heat transfer;International Journal of Thermal Sciences;2023-06
4. Heat transfer enhancement inside channel by using the Lattice Boltzmann Method;Thermal Science;2021
5. Support vector regression method for predicting temperatures of heat sources cooled by forced convection in a horizontal channel;Thermal Science and Engineering Progress;2020-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3