1. Stress and fracture at the chip/underfill interface in flip-chip assemblies;Park;J. Electronic Pack.,2003
2. Performance, Reliability Test Methods for Flip Chip, Chip Scale, BGA and other Surface Mount Array Package Applications, J-STD-029, IPC, USA, 2000.
3. Microstructural dependence of constitutive properties of eutectic SnAg and SnAgC solders;Wise,2003
4. Fatigue life models of SnAgCu and SnPb solder joints evaluated by experiments and simulations;Schubert,2003
5. Viscoplastic constitutive properties and energy-partioning model of lead-free Sn3.9Ag0.6Cu solder alloy;Zhang,2003