1. The search for the universal probe card solution;Dennis Bates,1997
2. Probe contact resistance variations during elevated temperature wafer test;Broz,1999
3. Development of probing mark analysis model;Chao,2003
4. Dynamics of backside wafer level microprobing;Ching,1998
5. Modeling the bending of probes used in semiconductor industry;Comeau;IEEE Trans. Semicond. Manuf.,1991