Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm-Reference-Cited by-同舟云学术

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Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Published:2011-08 Issue:8 Volume:1 Page:1292-1302
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Liu De-Shin,Chang Chi-Min,Tu Chin-Yi,Liu An-Hong,Huang Cheng-Fang,Lee Yi-Chang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/5977186/05959192.pdf?arnumber=5959192

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Experimental and Numerical Investigation Into Wafer Probing Parameters Based on Thin Wafer Breaking Strength;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-01

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