Author:
Zhu Z.Y.,Lee H.P.,Cheok B.T.
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference10 articles.
1. Thermo-mechanical modeling of a novel MCM-DL technology;Dunne,1996
2. Package-to-board attach reliability – ethodology and case study on OMPAC package;Nagaraj;ASME J. Electron. Packaging,1998
3. Interfacial thermal stress in layered structures: the stepped edge problem;Yin;ASME J. Electronic Packaging,1995
4. Thermal stresses in axisymmetric bimaterial assemblies: microelectronic applications;Mirman,1992
5. On non-linear thermo-mechanical analysis of IC packages;Hsu,1992
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