1. Computer simulation of impression creep by finite element method;Yu;J. Mater. Sci.,1977
2. X. Wang, L. Xu, The finite element model (FEM) analysis of thermal failure in connector, in: Proc. of the 2nd ICREPEC Conf. in Xiamen, China, (2007) 235–240.
3. K. Li, X.P. Su, Z.G. Li, J.G. Lu, G.S. Zhang, The finite element model and analysis of static contact resistance and thermal process for contact with film, in: Proc. of 44th IEEE Holm Conf. on Electrical Contacts, Washington DC, (1998) 226–229.
4. E. Schedin, A. Thuvander, P. Henderson, P. Sandberg, A. Kamf, Stress relaxation behaviour of connectors – development of simulation techniques, in: Proc. of 42th IEEE Holm Conf., (1996) 142–150.
5. R. Zauter, D.V. Kudashov, Precipitation hardened high copper alloys for connector pins made of wire, in: Proc. of Conf. ICEC, Sendai, Japan, (2006) 257–261.