Finite element modeling and simulation for bending analysis of multi-layer printed circuit boards using woven fiber composite-Reference-Cited by-同舟云学术

Finite element modeling and simulation for bending analysis of multi-layer printed circuit boards using woven fiber composite

Published:2008-05 Issue:1-3 Volume:201 Page:746-750
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Li L.,Kim S.M.,Song S.H.,Ku T.W.,Song W.J.,Kim J.,Chong M.K.,Park J.W.,Kang B.S.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference17 articles.

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3. Brown, E.N., Sottos, N.R., 1998. Thermoelastic properties of plain weave composites for multilayer circuit board applications, TAM Report no. 878. University of Illinois, Urbana, IL.

4. Printed Circuit Board Basics;Flatt,1992

5. Mechanics of Composite Materials;Jones,1975

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