1. Validation of new approach of modelling traces by mapping mechanical properties for a printed circuit board mechanical analysis;Yaddanapudi,2015
2. Finite element modeling and simulation for bending analysis of multi-layer printed circuit boards using woven fiber composite;Li;J. Mater. Process. Technol.,2008
3. Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability;Rahangdale,2017
4. Effect of temperature on elastic properties of woven-glass epoxy composites for printed circuit board applications;Hutapea;J. Electron. Mater.,2003
5. Impact of immersion cooling on thermo-mechanical properties of PCB's and reliability of electronic packages;Ramdas,2019