Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding-Reference-Cited by-同舟云学术

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Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding

Published:2016-10 Issue: Volume:236 Page:176-182
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Malfait Wim J.,Klemenčič Robert,Lang Britta,Rist Tobias,Klučka Martin,Zajacz Zoltan,Koebel Matthias M.

Funder

European Union

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference28 articles.

1. Design of a modular micropump based on anodic bonding;Acero;J. Micromech. Microeng.,1997

2. Irreversibility of anodic bonding;Albaugh;Mater. Lett.,1986

3. Anodic bonding of imperfect surfaces;Anthony;J. Appl. Phys.,1983

4. Triple stack glass-to-glass anodic bonding for optogalvanic spectroscopy cells with electrical feedthroughs;Daschner;Appl. Phys. Lett.,2014

5. Initiation of toughness of silicon/glass anodic bonds;Dunn;Acta Mater.,2000

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