Design of a modular micropump based on anodic bonding-Reference-Cited by-同舟云学术

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Design of a modular micropump based on anodic bonding

Published:1997-09-01 Issue:3 Volume:7 Page:179-182
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Acero M C,Plaza J A,Esteve J,Carmona M,Marco S,Samitier J

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Dynamic simulations of micropumps

Cited by 36 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding;Journal of Materials Processing Technology;2016-10

5. Anodic Bonding;Encyclopedia of Microfluidics and Nanofluidics;2014

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