Direct glass-to-metal joining by simultaneous anodic bonding and soldering with activated liquid tin solder
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference15 articles.
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3. Characterization of the electrostatic bonding of silicon and Pyrex glass;Cozma;J. Micromech. Microeng.,1995
4. Glass-to-glass anodic bonding with liquid tin based fillers: a mechanistic study;El Hawi;ECS J. Solid State Sci. Technol.,2013
5. Silicon-to-silicon anodic bonding with a borosilicate glass layer;Hanneborg;J. Micromech. Microeng.,1991
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