Large-scale anodic bonding mediated by a liquid tin solder-Reference-Cited by-同舟云学术

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Large-scale anodic bonding mediated by a liquid tin solder

Published:2017-08 Issue: Volume:246 Page:69-76
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Claure Ramirez Ernesto,Klemenčič Robert,Klučka Martin,Lang Britta,Beisel Samuel,Altorfer Heinz,Koebel Matthias M.,Malfait Wim J.

Funder

European Union

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference22 articles.

1. Anodic bonding of imperfect surfaces;Anthony;J. Appl. Phys.,1983

2. Reference data for the density and viscosity of liquid copper and liquid tin;Assael;J. Phys. Chem. Ref. Data,2010

3. Tin-free electroless metallization of glass substrates using different PACVD surface treatment processes;Charbonnier;Surf. Coat. Technol.,2003

4. Review article: recent advances in metal-ceramic brazing;Do Nascimento;Cerâmica,2003

5. Preparation, properties and chemistry of glass-and glass-ceramic-to-metal seals and coatings;Donald;J. Mater. Sci.,1993

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Silicate glass-to-glass hermetic bonding for encapsulation of next-generation optoelectronics: A review;Materials Today;2021-07

2. Glass-Cu joining by anodic bonding and soldering with eutectic Sn-9Zn solder;Journal of Alloys and Compounds;2019-06

3. Study on the mechanism of Si–glass–Si two step anodic bonding process;Journal of Micromechanics and Microengineering;2018-02-09

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