Incident ion characteristics in ionized physical vapor deposition using molecular dynamics simulation
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Reference34 articles.
1. Magnetron sputter deposition with high levels of metal ionization
2. Metal ion deposition from ionized mangetron sputtering discharge
3. Directional deposition of Cu into semiconductor trench structures using ionized magnetron sputtering
4. Ionized physical vapor deposition of Cu for high aspect ratio damascene trench fill applications
5. Interaction between gas rarefaction and metal ionization in ionized physical vapor deposition
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