Thermal degradation of rosin during high temperature solder reflow-Reference-Cited by-同舟云学术

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Thermal degradation of rosin during high temperature solder reflow

Published:1992-04 Issue:1 Volume:198 Page:7-20
ISSN:0040-6031
Container-title:Thermochimica Acta
language:en
Short-container-title:Thermochimica Acta

Author:

Artaki I.,Ray U.,Gordon H.M.,Gervasio M.S.

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference22 articles.

1. R.S. Basu and J.K. Bonner, Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood IL, TP-649, 1987.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Effect of heat treatment on Pinus pinaster rosin: A study of physico chemical changes and influence on the quality of rosin linseed oil varnish;Industrial Crops and Products;2020-11

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