DSA guiding template assignment with multiple redundant via and dummy via insertion-Reference-Cited by-同舟云学术

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DSA guiding template assignment with multiple redundant via and dummy via insertion

Published:2020-01 Issue: Volume:70 Page:32-42
ISSN:0167-9260
Container-title:Integration
language:en
Short-container-title:Integration

Author:

Li Xingquan,Yu Bei,Chen Jianli,Zhu Wenxing

Funder

National Natural Science Foundation of China

Research Grants Council of Hong Kong SAR

Minnan Normal University

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Reference24 articles.

1. Directed self-assembly of block copolymers for next generation nanolithography;Jeong;Mater. Today,2013

2. Guest editors introduction: design for yield and reliability;Zorian;IEEE Trans. Comput. Aided Des. Integr Circuits Syst.,2004

3. Redundant-via enhanced maze routing for yield improvement;Xu,2005

4. DSAR: DSA aware routing with simultaneous DSA guiding pattern and double patterning assignment;Ou,2017

5. Full-chip routing considering double-via insertion;Chen;IEEE Trans. Comput. Aided Des. Integr Circuits Syst.,2008

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