Self-triggering hardware trojan: Due to NBTI related aging in 3-D ICs
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Reference37 articles.
1. TSV-based 3D integration;Burns,2011
2. Mossa, S. Fulum, S. Hasan, A. Elkeelany, O. Sayed, "Introducing redundant TSV with low inductance for 3-D IC, in: Proceedings of the New Circuits and Systems Conference (NEWCAS), 2014 IEEE 12th International, pp. 117–120, 2014.
3. Grouped through silicon vias for lower Ldi/dt drop in three-dimensional integrated circuit;Mossa;IET Circuits Devices Syst.,2016
4. Thermal-aware post layout voltage-Island generation for 3D ICs;Xu;J. Comput. Sci. Technol.,2013
5. Puttaswamy, Kiran, Gabriel H. Loh. Thermal analysis of a 3D die-stacked high-performance microprocessor. in: Proceedings of the 16th ACM Great Lakes symposium on VLSI, pp. 19–24. ACM, 2006.
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