Role of Cu film texture in grain growth correlated with twin boundary formation-Reference-Cited by-同舟云学术

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Role of Cu film texture in grain growth correlated with twin boundary formation

Published:2012-01 Issue:2 Volume:60 Page:588-595
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Kohama Kazuyuki,Ito Kazuhiro,Matsumoto Takuya,Shirai Yasuharu,Murakami Masanori

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. Technology for advanced high-performance microprocessors

2. Effects of barrier layer and annealing on abnormal grain growth in copper thin films

3. Stress in Copper Thin Films with Barrier Layers

4. Texture in multilayer metallization structures

5. Textures of thin copper films

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanism of texture formation in submicron Cu thin films;Journal of Materials Research and Technology;2021-11

2. Using the room temperature creep to strengthen nanotwinned Ni: the scaling behavior between the twin thickness and the grain size;Materials Today Nano;2020-08

3. Interface roughness and texture in Co/Cu multilayers with Ti buffer layer;Materials Research Express;2019-07-12

4. Structure and stress of Cu films prepared by high power pulsed magnetron sputtering;Vacuum;2019-02

5. Grain Boundary Segregation in Nanocrystructured Metallic Materials;Study of Grain Boundary Character;2017-01-11

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